中文
倒装封装技术
在倒装芯片封装中，硅芯片使用焊接凸块而非焊线直接固定在基材上，提供密集的互连，具有很高的电气性能和热性能。倒装芯片互连实现了终极的微型化，减少了封装寄生效应，并且实现了其他传统封装方法无法实现的芯片功率分配和地线分配新模式。
J9技术优势
J9科技提供丰富的倒装芯片产品组合，从搭载无源元器件的大型单芯片封装，到模块和复杂的先进 3D 封装，包含多种不同的低成本创新选项。
资料下载
- FCOL - Flip Chip On Leadframe
- Fine Pitch Cu Pillar Assembly Challenges for Advanced Flip Chip Packages
- Fine Pitch Cu Pillar with BOL Assembly Challenges for Low Cost and High Performance Flip Chip Package
- Fine Pitch High Bandwidth Flip Chip Package-on-Package Development
- Large Flip Chip Assembly Challenges and Risk Mitigation Process
- Molded Laser fcPoP - Flip Chip Package-on-Package
- 10nm CPI Study for Fine Pitch Flip Chip Attach Process and Substrate
- Bare Die fcPoP - Flip Chip Package-on-Package
- fcBGA - Flip Chip Ball Grid Array
- fcCSP - Flip Chip Chip Scale Package
- fcCuBETM - Flip Chip with Cu Column, BOL & Enhanced Processes
